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- W2027147575 abstract "Ceramics like Si<SUB>3</SUB>N<SUB>4</SUB>, Al<SUB>2</SUB>O<SUB>3</SUB> and ZrO<SUB>2</SUB> and also diamonds can be hardly machined by conventional methods. Short pulse lasers, especially frequency-tripled, diode pumped Nd:YAG-lasers with a high beam quality offer the possibility to ablate these materials with high quality. With a spot size of about 10 micrometers , high fluences can be achieved, so that the materials are vaporized without or with only a small holes with diameters >= 5 micrometers and cutting of thin ceramic substrates. The edges are sharp and the face of the cut is very smooth. Furthermore it is possible to ablate three dimensional microstructures. Therefore the laser beam is scanned over the surface and the materials is ablated pulse beside optimized machining parameters the surface roughness can be reduced to R <EQ 0.1 micrometers . Due to the low ablation rate of around 0.05 (mu) g/pulse the ablation depth of a single slice can be controlled very precisely. Depending on the material and the machining parameters the depth is in the range of 1 to 10 micrometers ." @default.
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- W2027147575 date "1999-07-15" @default.
- W2027147575 modified "2023-09-23" @default.
- W2027147575 title "<title>High-accuracy micromachining of ceramics by frequency-tripled Nd:YAG lasers</title>" @default.
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