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• W2027333629 abstract "The theoretical foundations of post-solder cleaning process in the microelectronic industry have been developed taking into consideration the geometry of a printed wiring board (PWB) and the nature of its surface. Optimal technological conditions (spray pressure, orientation of PWB, temperature, and the nature of the cleaning or rinsing liquids) have been found and recommended for different consecutive steps. The first step of the post-solder cleaning process, which has been analyzed, is penetration of a cleaning solvent, solution, or emulsion into the gap under a surface mounted component (SMC). Criterion for the prevention of air entrapment under an SMC has been formulated and analyzed for two types of mechanical conditions: spraying and immersing. The influence of orientation of the PWB (horizontal or vertical), spray pressure, or rate of immersing on the possibility of air entrapment during this cleaning process, as well as influence of wettability of a solid surface have also been analyzed. Corresponding optimal conditions have been found. The second consecutive step of cleaning process is dissolution of rosin or other residues. It can be accelerated by an increase in the equilibrium value of solubility of the rosin residue in a cleaning liquid and by an increase in the rate of its dissolution. This can be achieved by recommended optimization of the chemical composition of a cleaning solution (emulsion) and/or its temperature. The third step of the process is the replacement of the rosin or other residue by a clean solvent. It can be accelerated by (a) an increase in pressure during the rinsing of the PWB by a solvent or water; (b) a decrease in the viscosity of the rinsing solution. (c) The rinsing liquid should not contain any components which decline the solubility of rosin in the cleaning solution during replacement. (d) There are two cases depending on the wettability ratio of the solid substrate by the rinsing and cleaning solutions. If the rinsing liquid wets the solid surface better than the cleaning one, a higher interfacial tension is more desirable. In the opposite case, the rinsing liquid should be miscible with a solution (emulsion) for cleaning, or both rinsing and cleaning solutions should have low interfacial tension." @default.
• W2027333629 created "2016-06-24" @default.
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• W2027333629 date "1988-01-01" @default.
• W2027333629 modified "2023-09-25" @default.
• W2027333629 title "Theoretical foundations of post-solder cleaning process for printed wiring assemblies" @default.
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• W2027333629 doi "https://doi.org/10.1016/0166-6622(88)80067-2" @default.
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