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- W2027363007 abstract "This paper describes effects of spin-on-glass (SOG) planarization layer etchback process on reliability of submicron vias for multilevel metalization. Resistance values of double-level metal via chains containing 4,000-200,000 vias in the 0.8-2.0 um size range have been measured. Mass spectra for outgas from SOG films have been studied in more detail. The SOG etchback process and the subsequent P-SiO layer deposition process have been executed in a multichamber CVD system. The multichamber processing can reduce the emission of outgas which degrades via yield and reliability." @default.
- W2027363007 created "2016-06-24" @default.
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- W2027363007 date "1990-02-15" @default.
- W2027363007 modified "2023-10-05" @default.
- W2027363007 title "Effects Of Multichamber Processing On Reliability Of Submicron Vias" @default.
- W2027363007 doi "https://doi.org/10.1117/12.963939" @default.
- W2027363007 hasPublicationYear "1990" @default.
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