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- W2027701909 abstract "The effects of plasma treatment on the surfaces of the flame resistant-4 (FR-4) and copper substrates are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angle, and atomic force microscopy (AFM). The adhesion strengths of the underfills/FR-4 substrate and underfills/copper substrate are also studied. As experimental results, the plasma treatments of FR-4 and copper substrate surfaces yield several oxygen complexes in hydrophilic surfaces, which can play an important role in increasing the surface polarity, wettability, and adhesion characteristics of the underfills/substrates. And, the curing temperature ranges of the underfills, which have the maximum adhesion strength of the underfills/FR-4 substrate and underfills/copper substrate, were 140–150 °C." @default.
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- W2027701909 date "2007-04-01" @default.
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- W2027701909 title "Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate" @default.
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- W2027701909 doi "https://doi.org/10.1016/j.ijadhadh.2006.03.005" @default.
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