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- W2027931035 abstract "Historically Cu wire has been targeted to lower pin count high power discrete devices and consumer product for a long time. As gold costs increased the industry started focusing on moving more mainstream products to Cu wire. Markets that have seen the largest growth in Cu wire bonded products include consumer electronics, communication devices and industrial electronics etc. However, Cu wire has been used sparingly in high reliability markets which require stringent and extensive reliability performance. One of the reasons is that the leading edge silicon nodes with low-k/ELK device bonding pads are vulnerable to damage during wire bond process even with gold wire." @default.
- W2027931035 created "2016-06-24" @default.
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- W2027931035 date "2011-12-01" @default.
- W2027931035 modified "2023-09-27" @default.
- W2027931035 title "Cu wire bonding for fine pitch 40nm circuit under pad silicon integrated circuits: Development of a comprehensive robust Cu wire bonding process" @default.
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- W2027931035 doi "https://doi.org/10.1109/eptc.2011.6184376" @default.
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