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• W2029007371 abstract "This paper presents results from a study on the effect of Si-micromachined packaging on the performance of K-band circuits. Components inclduding interconnects and stubs have been fabricated using finite ground coplanar (FGC) transmission lines and results indicate that nonmetalized air cavities introduce fewer parasitics as compared to metalized air cavities. Flip-chip devices have been incorporated to design a packaged 3-stage low noise amplifier (LNA). The performance of flip-chip Indium Phosphide (InP) high electron mobility trnsistors (HEMTs) in the host substrate environment is measured and used to design the packaged LNA for desired performance." @default.
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• W2029007371 date "1999-10-01" @default.
• W2029007371 modified "2023-09-24" @default.
• W2029007371 title "The Effects of Si-Micromachined On-Wafer Packaging on the Performance of K-Band Circuits" @default.
• W2029007371 doi "https://doi.org/10.1109/euma.1999.338476" @default.
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