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- W2029141205 abstract "Steady-state thermal performance of the 164-Lead flip chip plastic ball grid array (FC-PBGA) under low to moderate convective air cooling conditions is simulated with CFX software. A package with three different substrates is investigated. Package performance is presented in the form of a linear relationship between the normalized junction to ambient thermal parameter (θJA) versus the normalized board to ambient thermal parameter (θJB). The chip corner and the contact surface have a larger temperature difference, produce a mismatch phenomenon, and result in the destruction of the solder ball. © 2004 Wiley Periodicals, Inc. Heat Trans Asian Res, 33(6): 371–382, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20026" @default.
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- W2029141205 date "2004-01-01" @default.
- W2029141205 modified "2023-09-27" @default.
- W2029141205 title "Thermal analysis of flip chip plastic ball grid array assembly" @default.
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- W2029141205 doi "https://doi.org/10.1002/htj.20026" @default.
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