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- W2029207819 abstract "TiN is widely used as a diffusion barrier layer. Uniformity of the thickness and composition of this layer is dependent on the deposition conditions and is important for production yield. This uniformity is routinely derived from the sheet resistance measurements. Due to the correlation between composition and thickness in resistivity measurements, thus derived thickness can be incorrect. Use of the multiple angles of incidence (MAI) ellipsometry with a blue Ar+ laser (458 nm) allows to decouple thickness and composition effects and ensures accurate measurements over 1000 Å for TiNx (x ≥ 1.1). Comparison of the MAI ellipsometry, spectroscopic ellipsometry (SE), profilometry and resistivity measurements of TiN layer on a specially prepared wafers confirms reliability and accuracy of the MAI ellipsometry measurement. Tracking of the composition and thickness variation of the TiN across the wafers with the MAI ellipsometry is found consistent with the SE and profilometry measurements." @default.
- W2029207819 created "2016-06-24" @default.
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- W2029207819 date "1997-11-01" @default.
- W2029207819 modified "2023-09-26" @default.
- W2029207819 title "Control of PVD TiN thickness measurements" @default.
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- W2029207819 doi "https://doi.org/10.1016/s0167-9317(97)00142-1" @default.
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