Matches in SemOpenAlex for { <https://semopenalex.org/work/W2029314976> ?p ?o ?g. }
Showing items 1 to 92 of
92
with 100 items per page.
- W2029314976 abstract "This paper describes the ongoing research and development at Amkor Technology of Chip-on-chip/Face to Face (CoC/F2F) technology being developed in parallel with Through Silicon Via (TSV) package assembly. Unlike other 3D packaging techniques using TSVs that require front end processing, CoC/F2F technology uses existing chip attach (C/A) or thermal compression (TC) equipment to connect each die - referred to as the mother die and daughter die for the larger and smaller ICs, respectively. The cost to assemble CoC/F2F is relatively inexpensive, making it an attractive alternative to TSV for many applications. Some of these include the integration of ASIC with logic, MEMS with ASIC, microcontroller with memory, and optoelectronic module with microcontroller." @default.
- W2029314976 created "2016-06-24" @default.
- W2029314976 creator A5012772611 @default.
- W2029314976 creator A5015109477 @default.
- W2029314976 creator A5018046748 @default.
- W2029314976 creator A5028125201 @default.
- W2029314976 creator A5034423713 @default.
- W2029314976 creator A5046875800 @default.
- W2029314976 creator A5048311584 @default.
- W2029314976 creator A5057379487 @default.
- W2029314976 creator A5070899719 @default.
- W2029314976 date "2013-05-01" @default.
- W2029314976 modified "2023-09-27" @default.
- W2029314976 title "Development of chip-on-chip with face to face technology as a low cost alternative for 3D packaging" @default.
- W2029314976 cites W2143502515 @default.
- W2029314976 cites W2171990275 @default.
- W2029314976 cites W3137712834 @default.
- W2029314976 cites W3139689176 @default.
- W2029314976 cites W4292169167 @default.
- W2029314976 doi "https://doi.org/10.1109/ectc.2013.6575690" @default.
- W2029314976 hasPublicationYear "2013" @default.
- W2029314976 type Work @default.
- W2029314976 sameAs 2029314976 @default.
- W2029314976 citedByCount "6" @default.
- W2029314976 countsByYear W20293149762014 @default.
- W2029314976 countsByYear W20293149762017 @default.
- W2029314976 countsByYear W20293149762018 @default.
- W2029314976 countsByYear W20293149762019 @default.
- W2029314976 countsByYear W20293149762022 @default.
- W2029314976 crossrefType "proceedings-article" @default.
- W2029314976 hasAuthorship W2029314976A5012772611 @default.
- W2029314976 hasAuthorship W2029314976A5015109477 @default.
- W2029314976 hasAuthorship W2029314976A5018046748 @default.
- W2029314976 hasAuthorship W2029314976A5028125201 @default.
- W2029314976 hasAuthorship W2029314976A5034423713 @default.
- W2029314976 hasAuthorship W2029314976A5046875800 @default.
- W2029314976 hasAuthorship W2029314976A5048311584 @default.
- W2029314976 hasAuthorship W2029314976A5057379487 @default.
- W2029314976 hasAuthorship W2029314976A5070899719 @default.
- W2029314976 hasConcept C111106434 @default.
- W2029314976 hasConcept C111919701 @default.
- W2029314976 hasConcept C126233035 @default.
- W2029314976 hasConcept C127413603 @default.
- W2029314976 hasConcept C149635348 @default.
- W2029314976 hasConcept C165005293 @default.
- W2029314976 hasConcept C173018170 @default.
- W2029314976 hasConcept C193149544 @default.
- W2029314976 hasConcept C41008148 @default.
- W2029314976 hasConcept C76155785 @default.
- W2029314976 hasConcept C77390884 @default.
- W2029314976 hasConcept C78519656 @default.
- W2029314976 hasConcept C9390403 @default.
- W2029314976 hasConceptScore W2029314976C111106434 @default.
- W2029314976 hasConceptScore W2029314976C111919701 @default.
- W2029314976 hasConceptScore W2029314976C126233035 @default.
- W2029314976 hasConceptScore W2029314976C127413603 @default.
- W2029314976 hasConceptScore W2029314976C149635348 @default.
- W2029314976 hasConceptScore W2029314976C165005293 @default.
- W2029314976 hasConceptScore W2029314976C173018170 @default.
- W2029314976 hasConceptScore W2029314976C193149544 @default.
- W2029314976 hasConceptScore W2029314976C41008148 @default.
- W2029314976 hasConceptScore W2029314976C76155785 @default.
- W2029314976 hasConceptScore W2029314976C77390884 @default.
- W2029314976 hasConceptScore W2029314976C78519656 @default.
- W2029314976 hasConceptScore W2029314976C9390403 @default.
- W2029314976 hasLocation W20293149761 @default.
- W2029314976 hasOpenAccess W2029314976 @default.
- W2029314976 hasPrimaryLocation W20293149761 @default.
- W2029314976 hasRelatedWork W1575606279 @default.
- W2029314976 hasRelatedWork W1576992642 @default.
- W2029314976 hasRelatedWork W1578839933 @default.
- W2029314976 hasRelatedWork W1606530555 @default.
- W2029314976 hasRelatedWork W1636189610 @default.
- W2029314976 hasRelatedWork W1832230270 @default.
- W2029314976 hasRelatedWork W1899170524 @default.
- W2029314976 hasRelatedWork W1967421508 @default.
- W2029314976 hasRelatedWork W2024252480 @default.
- W2029314976 hasRelatedWork W2056960558 @default.
- W2029314976 hasRelatedWork W2070214512 @default.
- W2029314976 hasRelatedWork W2117512401 @default.
- W2029314976 hasRelatedWork W2122962364 @default.
- W2029314976 hasRelatedWork W2132054868 @default.
- W2029314976 hasRelatedWork W2139436419 @default.
- W2029314976 hasRelatedWork W2145747204 @default.
- W2029314976 hasRelatedWork W2148695379 @default.
- W2029314976 hasRelatedWork W2148975244 @default.
- W2029314976 hasRelatedWork W2166803207 @default.
- W2029314976 hasRelatedWork W2542942915 @default.
- W2029314976 isParatext "false" @default.
- W2029314976 isRetracted "false" @default.
- W2029314976 magId "2029314976" @default.
- W2029314976 workType "article" @default.