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- W2029530099 abstract "Tungsten through-silicon via (W-TSV) technology is investigated for the fabrication of three-dimensional (3D) LSI chips having low-resistive TSVs with a width less than 3 µm. In our 3D integration technology, completed two-dimensional (2D) LSI chips including metal–oxide–semiconductor field-effect transistors (MOSFETs) and metal wirings are vertically stacked through a number of short vertical interconnections called TSV with lengths ranging from several microns to several tens of microns. The W-TSV technology is mainly divided into three low-temperature processes: deep-trench etching, dielectric layer formation, and filling with a conductive material. We successfully formed deep Si trenches through a 6-µm-thick SiO2 dielectric layer by the modified Bosch process. The depth of the resulting Si trenches with a dielectric layer is approximately 40 µm. A SiO2 layer was formed at the bottom and on the sidewall of the Si trenches by sub-atmospheric chemical vapor deposition (SACVD) method using tetraethylorthosilicate (TEOS) and O3. In addition, we succeeded in uniformly depositing a conformal W metal layer by time-modulated W-CVD method at 300 °C." @default.
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- W2029530099 date "2008-04-25" @default.
- W2029530099 modified "2023-10-09" @default.
- W2029530099 title "Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs" @default.
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- W2029530099 doi "https://doi.org/10.1143/jjap.47.2801" @default.
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