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- W2029691413 abstract "A wafer-bumped TAB (tape automated bonding) device called the fine-pitch TAB device, which has been applied to a LCD (liquid crystal display) panel designed for a flat-panel display, is introduced and described. The devices, fabricated with flat-surface bumps and a straight side-wall structure instead of the conventional mushroom structure, have several important features, i.e. (1) the shear strength has an average value of 8.65*10/sup 3/ gr/mm/sup 2/, (2) the inner lead pitch (the bump pitch) is 100 mu m in the mass products, and a pitch of about 40 mu m is achieved in the test vehicle. The technique utilizes a triple layer of intermediate metals consisting of titanium, nickel, and palladium, applies the bump photoengraving process using a dry-film resist, uses the cyanide electroplating technique, and uses the ILB (inner lead bonding)/OLB (outer lead bonding) equipment with higher alignment accuracy.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
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- W2029691413 date "1989-01-01" @default.
- W2029691413 modified "2023-09-27" @default.
- W2029691413 title "Fine pitch TAB technology with straight side wall bump structure for LCD panel" @default.
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- W2029691413 doi "https://doi.org/10.1109/30.44290" @default.
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