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- W2029715090 abstract "Aqueous cleaning solutions were developed for postetch cleaning of tungsten layers to replace the amine-based organic strippers. They are composed of tetramethylammonium hydroxide, HF, and two additives. Even the cleaning recipes without a strong oxidant, such as hydrogen peroxide, could remove postetch residues formed by reactive ion etching and they also had the same particle removal efficiency compared to ammonium and hydrogen peroxide mixture known as RCA Standard Clean. The concentration of metal ion on the wafer surface after cleaning by them was under 1010 atoms/cm 2 . The effects of the cleaning could be explained by applying Pan's double-layer model [J. Electrochem. Soc., 148, G315 (2001)]. In fact, these cleaning solutions made it possible to decrease the resistances of tungsten bit lines and metal contacts and contributed to yield enhancement." @default.
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- W2029715090 date "2009-01-01" @default.
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- W2029715090 title "Nonoxidative Aqueous Cleaning Solutions for Tungsten Layers" @default.
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- W2029715090 doi "https://doi.org/10.1149/1.3054443" @default.
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