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- W2029855945 abstract "The search for better yields in IC manufacturing calls for a smarter use of the vast amount of data that can be generated by a world class production line.In this scenario, in-line inspection processes produce thousands of wafer maps, number of defects, defect type and pictures every day. A step forward is to correlate these with the other big data- generator area: test. In this paper, we present how these data can be put together and correlated to obtain a very useful yield predicting tool. This correlation will first allow us to calculate the kill ratio, i.e. the probability for a defect of a certain size in a certain layer to kill the die. Then we will use that number to estimate the cosmetic yield that a wafer will have." @default.
- W2029855945 created "2016-06-24" @default.
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- W2029855945 date "1999-04-27" @default.
- W2029855945 modified "2023-09-27" @default.
- W2029855945 title "Kill ratio calculation for in-line yield prediction" @default.
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- W2029855945 doi "https://doi.org/10.1117/12.346923" @default.
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