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- W2030254145 abstract "Purpose – The purpose of this paper is to develop a thermal coupling method of a ball grid array (BGA) assembly during a forced convection reflow soldering process." @default.
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- W2030254145 date "2012-04-06" @default.
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- W2030254145 title "Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process" @default.
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