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• W2030485203 endingPage "L1392" @default.
• W2030485203 startingPage "L1392" @default.
• W2030485203 abstract "Using dimethylaluminum hydride as a source gas, aluminum thin films with low-electrical resistivity were deposited via photochemical reactions induced by a deuterium lamp. The best resistivity was 6.2 µΩ·cm, which was as low as 2.3 times the value of bulk aluminum. Deposition rates increased with substrate temperature. At 200°C the rate was 20 nm/min. A disk-like thickness profile, as well as the vapor pressure dependence of deposition rates, indicated that surface reactions dominated." @default.
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• W2030485203 date "1988-08-01" @default.
• W2030485203 modified "2023-09-26" @default.
• W2030485203 title "Photochemical Vapor Deposition of Aluminum Thin Films Using Dimethylaluminum Hydride" @default.
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• W2030485203 doi "https://doi.org/10.1143/jjap.27.l1392" @default.
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