Matches in SemOpenAlex for { <https://semopenalex.org/work/W2030885738> ?p ?o ?g. }
Showing items 1 to 84 of
84
with 100 items per page.
- W2030885738 endingPage "947" @default.
- W2030885738 startingPage "941" @default.
- W2030885738 abstract "There has been an intensive effort in the industries in recent years to replace leaded solder with lead-free process in order to minimize the emission of toxic materials. However, leaded solder is still used in many cases where no alternative lead-free process is currently available. Leaded soldering of the wire terminals is one of the worst examples as it causes cross contamination of lead into the lead-free solder bath during the successive process. To avoid this problem, it is important to develop a new process of successfully removing polymer film coated on a copper wire. We have investigated the use of atmospheric pressure plasma as a solution for the polymer removal in conjunction with lead-free solder plating. The atmospheric plasma technology has some unique advantages compared with the conventional low pressure plasma processes such as low cost operation and high speed processing as the chemical reaction tends to be more enhanced at higher pressure. An atmospheric micro-plasma source was thus developed for this purpose and its high etching rate of more than 100 μm/min with fluorine gas mixture was demonstrated. Furthermore, it was found that the copper wires processed by this plasma could be readily plated with lead-free solder at low temperature of 250°C without any use of fluxes even at 168 h after removing the polymer film." @default.
- W2030885738 created "2016-06-24" @default.
- W2030885738 creator A5004458329 @default.
- W2030885738 creator A5016514452 @default.
- W2030885738 creator A5039341879 @default.
- W2030885738 creator A5065413050 @default.
- W2030885738 creator A5073619436 @default.
- W2030885738 date "2006-01-01" @default.
- W2030885738 modified "2023-09-25" @default.
- W2030885738 title "Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand" @default.
- W2030885738 cites W1993498679 @default.
- W2030885738 cites W2041013490 @default.
- W2030885738 cites W2088965515 @default.
- W2030885738 cites W2511128817 @default.
- W2030885738 cites W2043556066 @default.
- W2030885738 doi "https://doi.org/10.2320/matertrans.47.941" @default.
- W2030885738 hasPublicationYear "2006" @default.
- W2030885738 type Work @default.
- W2030885738 sameAs 2030885738 @default.
- W2030885738 citedByCount "2" @default.
- W2030885738 crossrefType "journal-article" @default.
- W2030885738 hasAuthorship W2030885738A5004458329 @default.
- W2030885738 hasAuthorship W2030885738A5016514452 @default.
- W2030885738 hasAuthorship W2030885738A5039341879 @default.
- W2030885738 hasAuthorship W2030885738A5065413050 @default.
- W2030885738 hasAuthorship W2030885738A5073619436 @default.
- W2030885738 hasBestOaLocation W20308857381 @default.
- W2030885738 hasConcept C100460472 @default.
- W2030885738 hasConcept C111368507 @default.
- W2030885738 hasConcept C114793014 @default.
- W2030885738 hasConcept C121332964 @default.
- W2030885738 hasConcept C127313418 @default.
- W2030885738 hasConcept C159985019 @default.
- W2030885738 hasConcept C191897082 @default.
- W2030885738 hasConcept C192562407 @default.
- W2030885738 hasConcept C200239111 @default.
- W2030885738 hasConcept C2777093003 @default.
- W2030885738 hasConcept C2779227376 @default.
- W2030885738 hasConcept C2988571348 @default.
- W2030885738 hasConcept C50296614 @default.
- W2030885738 hasConcept C544778455 @default.
- W2030885738 hasConcept C60581705 @default.
- W2030885738 hasConcept C62520636 @default.
- W2030885738 hasConcept C82706917 @default.
- W2030885738 hasConcept C85344455 @default.
- W2030885738 hasConceptScore W2030885738C100460472 @default.
- W2030885738 hasConceptScore W2030885738C111368507 @default.
- W2030885738 hasConceptScore W2030885738C114793014 @default.
- W2030885738 hasConceptScore W2030885738C121332964 @default.
- W2030885738 hasConceptScore W2030885738C127313418 @default.
- W2030885738 hasConceptScore W2030885738C159985019 @default.
- W2030885738 hasConceptScore W2030885738C191897082 @default.
- W2030885738 hasConceptScore W2030885738C192562407 @default.
- W2030885738 hasConceptScore W2030885738C200239111 @default.
- W2030885738 hasConceptScore W2030885738C2777093003 @default.
- W2030885738 hasConceptScore W2030885738C2779227376 @default.
- W2030885738 hasConceptScore W2030885738C2988571348 @default.
- W2030885738 hasConceptScore W2030885738C50296614 @default.
- W2030885738 hasConceptScore W2030885738C544778455 @default.
- W2030885738 hasConceptScore W2030885738C60581705 @default.
- W2030885738 hasConceptScore W2030885738C62520636 @default.
- W2030885738 hasConceptScore W2030885738C82706917 @default.
- W2030885738 hasConceptScore W2030885738C85344455 @default.
- W2030885738 hasIssue "3" @default.
- W2030885738 hasLocation W20308857381 @default.
- W2030885738 hasOpenAccess W2030885738 @default.
- W2030885738 hasPrimaryLocation W20308857381 @default.
- W2030885738 hasRelatedWork W1532838940 @default.
- W2030885738 hasRelatedWork W1969763307 @default.
- W2030885738 hasRelatedWork W1986162116 @default.
- W2030885738 hasRelatedWork W2030885738 @default.
- W2030885738 hasRelatedWork W2033122511 @default.
- W2030885738 hasRelatedWork W2165678459 @default.
- W2030885738 hasRelatedWork W2493604093 @default.
- W2030885738 hasRelatedWork W2738063522 @default.
- W2030885738 hasRelatedWork W3156373006 @default.
- W2030885738 hasRelatedWork W2141234336 @default.
- W2030885738 hasVolume "47" @default.
- W2030885738 isParatext "false" @default.
- W2030885738 isRetracted "false" @default.
- W2030885738 magId "2030885738" @default.
- W2030885738 workType "article" @default.