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- W2031617470 abstract "The miniaturization of microwiring substrates which are used for high-density chip packaging imposes increasing problems on electrical testing. Mechanical probes fail to contact pads reliably in the 50 µm range and are limited to a fixed pad configuration. An electron-beam test system has been developed to overcome these problems. It uses CAD data for flexible beam positioning within a 10 cm × 10 cm field. An electron probe with a spot size of 40 µm is used for charging networks and reading pad voltages. The system has already demonstrated its operation by detecting shorts and opens on a limited number of substrates which were rejected as defective by a mechanical prober during the final test of the current production." @default.
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- W2031617470 date "1990-11-01" @default.
- W2031617470 modified "2023-09-23" @default.
- W2031617470 title "Electron-Beam Testing of Microwiring Substrates" @default.
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- W2031617470 doi "https://doi.org/10.1143/jjap.29.2671" @default.
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