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• W2032053805 startingPage "59" @default.
• W2032053805 abstract "Infrared reflection spectra have been measured in silica glasses which are initially damaged by 2 MeV O+- and 1.5. MeV C+-ion implantations then isothermally annealed at 200, 300, 400, 500 and 600°C. Thermal annealing effects on SiOSi bond angles have been deduced from the peak wavenumber shift of the 1100 cm−1 band in the infrared reflection spectra. The relaxation of SiOSi bond angles obeys the stretched exponential decay function with β ranging from 0.28 to 0.15. It is deduced that the relaxation of SiOSi bond angles has a distribution of activation energies. The major relaxation mechanism of SiOSi bond angles has an activation energy of 118 kJ/mol. It is inferred that the relaxation of SiOSi bond angle is due to a small movement of SiO4 tetrahedra without the disruption of SiO bonds." @default.
• W2032053805 created "2016-06-24" @default.
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• W2032053805 date "1993-10-01" @default.
• W2032053805 modified "2023-09-25" @default.
• W2032053805 title "Thermal annealing behavior of ion-implanted silica glass" @default.
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• W2032053805 doi "https://doi.org/10.1016/0022-3093(93)90645-e" @default.
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