FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2032730588> ?p ?o ?g. }

• W2032730588 endingPage "C78" @default.
• W2032730588 startingPage "C78" @default.
• W2032730588 abstract "Bottom-up fill of Cu in deep submicrometer via holes was achieved through electroless plating alone for the first time. We investigated the effect of addition of inhibitor molecules to electroless Cu plating solution, and found that sulfopropyl sulfonate (SPS) was highly effective in promoting the bottom-up fill. The tendency for bottom-up filling was enhanced by shrinkage of the hole diameter. This suggests that the diffusion flux of SPS molecules to the bottom of holes was more suppressed for smaller holes. Thus, the Cu deposition rate near the hole bottom is larger than that outside the hole, leading to bottom-up filling. © 2004 The Electrochemical Society. All rights reserved." @default.
• W2032730588 created "2016-06-24" @default.
• W2032730588 creator A5025573905 @default.
• W2032730588 creator A5030954721 @default.
• W2032730588 creator A5048359994 @default.
• W2032730588 creator A5061888340 @default.
• W2032730588 creator A5067629492 @default.
• W2032730588 creator A5078045278 @default.
• W2032730588 date "2004-01-01" @default.
• W2032730588 modified "2023-09-25" @default.
• W2032730588 title "Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating" @default.
• W2032730588 cites W1851896572 @default.
• W2032730588 cites W1967870965 @default.
• W2032730588 cites W1990389814 @default.
• W2032730588 cites W1995804739 @default.
• W2032730588 cites W2008218652 @default.
• W2032730588 cites W2010009345 @default.
• W2032730588 cites W2011858709 @default.
• W2032730588 cites W2013779936 @default.
• W2032730588 cites W2018101740 @default.
• W2032730588 cites W2020263658 @default.
• W2032730588 cites W2027228089 @default.
• W2032730588 cites W2031290258 @default.
• W2032730588 cites W2054616544 @default.
• W2032730588 cites W2064964609 @default.
• W2032730588 cites W2071977572 @default.
• W2032730588 cites W2082486984 @default.
• W2032730588 cites W2113238227 @default.
• W2032730588 cites W2121771181 @default.
• W2032730588 cites W2126463803 @default.
• W2032730588 cites W2143485111 @default.
• W2032730588 cites W2170941877 @default.
• W2032730588 cites W2952168973 @default.
• W2032730588 cites W4255172493 @default.
• W2032730588 doi "https://doi.org/10.1149/1.1707029" @default.
• W2032730588 hasPublicationYear "2004" @default.
• W2032730588 type Work @default.
• W2032730588 sameAs 2032730588 @default.
• W2032730588 citedByCount "81" @default.
• W2032730588 countsByYear W20327305882012 @default.
• W2032730588 countsByYear W20327305882013 @default.
• W2032730588 countsByYear W20327305882014 @default.
• W2032730588 countsByYear W20327305882015 @default.
• W2032730588 countsByYear W20327305882016 @default.
• W2032730588 countsByYear W20327305882017 @default.
• W2032730588 countsByYear W20327305882018 @default.
• W2032730588 countsByYear W20327305882019 @default.
• W2032730588 countsByYear W20327305882022 @default.
• W2032730588 countsByYear W20327305882023 @default.
• W2032730588 crossrefType "journal-article" @default.
• W2032730588 hasAuthorship W2032730588A5025573905 @default.
• W2032730588 hasAuthorship W2032730588A5030954721 @default.
• W2032730588 hasAuthorship W2032730588A5048359994 @default.
• W2032730588 hasAuthorship W2032730588A5061888340 @default.
• W2032730588 hasAuthorship W2032730588A5067629492 @default.
• W2032730588 hasAuthorship W2032730588A5078045278 @default.
• W2032730588 hasConcept C121332964 @default.
• W2032730588 hasConcept C127313418 @default.
• W2032730588 hasConcept C127413603 @default.
• W2032730588 hasConcept C147789679 @default.
• W2032730588 hasConcept C151730666 @default.
• W2032730588 hasConcept C159985019 @default.
• W2032730588 hasConcept C171250308 @default.
• W2032730588 hasConcept C17525397 @default.
• W2032730588 hasConcept C180145272 @default.
• W2032730588 hasConcept C185592680 @default.
• W2032730588 hasConcept C191897082 @default.
• W2032730588 hasConcept C192562407 @default.
• W2032730588 hasConcept C2776985018 @default.
• W2032730588 hasConcept C2779227376 @default.
• W2032730588 hasConcept C2780727033 @default.
• W2032730588 hasConcept C2816523 @default.
• W2032730588 hasConcept C29216876 @default.
• W2032730588 hasConcept C42360764 @default.
• W2032730588 hasConcept C51807945 @default.
• W2032730588 hasConcept C52859227 @default.
• W2032730588 hasConcept C544778455 @default.
• W2032730588 hasConcept C64297162 @default.
• W2032730588 hasConcept C69357855 @default.
• W2032730588 hasConcept C8058405 @default.
• W2032730588 hasConcept C86803240 @default.
• W2032730588 hasConcept C97355855 @default.
• W2032730588 hasConceptScore W2032730588C121332964 @default.
• W2032730588 hasConceptScore W2032730588C127313418 @default.
• W2032730588 hasConceptScore W2032730588C127413603 @default.
• W2032730588 hasConceptScore W2032730588C147789679 @default.
• W2032730588 hasConceptScore W2032730588C151730666 @default.
• W2032730588 hasConceptScore W2032730588C159985019 @default.
• W2032730588 hasConceptScore W2032730588C171250308 @default.
• W2032730588 hasConceptScore W2032730588C17525397 @default.
• W2032730588 hasConceptScore W2032730588C180145272 @default.
• W2032730588 hasConceptScore W2032730588C185592680 @default.
• W2032730588 hasConceptScore W2032730588C191897082 @default.
• W2032730588 hasConceptScore W2032730588C192562407 @default.
• W2032730588 hasConceptScore W2032730588C2776985018 @default.
• W2032730588 hasConceptScore W2032730588C2779227376 @default.
• W2032730588 hasConceptScore W2032730588C2780727033 @default.
• W2032730588 hasConceptScore W2032730588C2816523 @default.

• next