Matches in SemOpenAlex for { <https://semopenalex.org/work/W2033341036> ?p ?o ?g. }
- W2033341036 abstract "The use of flip chip bonding technology on AuSn microbumps for flip chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip chip technology are suitability for very fine pitch interconnection, low assembly cost and fluxless bonding. Fluxless flip chip assembly is in demand especially for medical applications and optoelectonics packaging. Here, we report the assembly process development of a silicon stacked module assembled with AuSn microbumps to meet the stringent reliability. The effects of bond pressure distribution, bond temperature and alignment accuracy were found to be critical in this stacked silicon using AuSn microbumps. A three-factor design of experiment (DOE) was carried out to investigate the effects of assembly parameters such as bonding pressure, temperature and time on contact resistance and AuSn solder wetting on the eNiAu UBM. Results showed that higher bond force is undesirable and contributes to passivation cracking and deformed AuSn joint with AuSn solder being squeezed out of the joint during bonding. The reliability result of the flip chip assembly of stacked silicon module using AuSn microbumps was presented." @default.
- W2033341036 created "2016-06-24" @default.
- W2033341036 creator A5005023231 @default.
- W2033341036 creator A5006431411 @default.
- W2033341036 creator A5014799550 @default.
- W2033341036 creator A5023994607 @default.
- W2033341036 creator A5028576917 @default.
- W2033341036 creator A5047130758 @default.
- W2033341036 creator A5053880472 @default.
- W2033341036 creator A5067099099 @default.
- W2033341036 creator A5075448760 @default.
- W2033341036 date "2008-12-01" @default.
- W2033341036 modified "2023-10-05" @default.
- W2033341036 title "Process Development and Reliability of Microbumps" @default.
- W2033341036 cites W2115696573 @default.
- W2033341036 cites W2131597737 @default.
- W2033341036 cites W2132832400 @default.
- W2033341036 cites W2137830489 @default.
- W2033341036 cites W2154329936 @default.
- W2033341036 doi "https://doi.org/10.1109/eptc.2008.4763462" @default.
- W2033341036 hasPublicationYear "2008" @default.
- W2033341036 type Work @default.
- W2033341036 sameAs 2033341036 @default.
- W2033341036 citedByCount "2" @default.
- W2033341036 countsByYear W20333410362022 @default.
- W2033341036 crossrefType "proceedings-article" @default.
- W2033341036 hasAuthorship W2033341036A5005023231 @default.
- W2033341036 hasAuthorship W2033341036A5006431411 @default.
- W2033341036 hasAuthorship W2033341036A5014799550 @default.
- W2033341036 hasAuthorship W2033341036A5023994607 @default.
- W2033341036 hasAuthorship W2033341036A5028576917 @default.
- W2033341036 hasAuthorship W2033341036A5047130758 @default.
- W2033341036 hasAuthorship W2033341036A5053880472 @default.
- W2033341036 hasAuthorship W2033341036A5067099099 @default.
- W2033341036 hasAuthorship W2033341036A5075448760 @default.
- W2033341036 hasConcept C111106434 @default.
- W2033341036 hasConcept C119599485 @default.
- W2033341036 hasConcept C121332964 @default.
- W2033341036 hasConcept C123745756 @default.
- W2033341036 hasConcept C125619702 @default.
- W2033341036 hasConcept C127413603 @default.
- W2033341036 hasConcept C153294291 @default.
- W2033341036 hasConcept C159985019 @default.
- W2033341036 hasConcept C163258240 @default.
- W2033341036 hasConcept C165005293 @default.
- W2033341036 hasConcept C171250308 @default.
- W2033341036 hasConcept C177564732 @default.
- W2033341036 hasConcept C192562407 @default.
- W2033341036 hasConcept C204530211 @default.
- W2033341036 hasConcept C2779227376 @default.
- W2033341036 hasConcept C31258907 @default.
- W2033341036 hasConcept C33574316 @default.
- W2033341036 hasConcept C41008148 @default.
- W2033341036 hasConcept C43214815 @default.
- W2033341036 hasConcept C49040817 @default.
- W2033341036 hasConcept C50296614 @default.
- W2033341036 hasConcept C530198007 @default.
- W2033341036 hasConcept C544956773 @default.
- W2033341036 hasConcept C59088047 @default.
- W2033341036 hasConcept C62520636 @default.
- W2033341036 hasConcept C68928338 @default.
- W2033341036 hasConcept C79072407 @default.
- W2033341036 hasConceptScore W2033341036C111106434 @default.
- W2033341036 hasConceptScore W2033341036C119599485 @default.
- W2033341036 hasConceptScore W2033341036C121332964 @default.
- W2033341036 hasConceptScore W2033341036C123745756 @default.
- W2033341036 hasConceptScore W2033341036C125619702 @default.
- W2033341036 hasConceptScore W2033341036C127413603 @default.
- W2033341036 hasConceptScore W2033341036C153294291 @default.
- W2033341036 hasConceptScore W2033341036C159985019 @default.
- W2033341036 hasConceptScore W2033341036C163258240 @default.
- W2033341036 hasConceptScore W2033341036C165005293 @default.
- W2033341036 hasConceptScore W2033341036C171250308 @default.
- W2033341036 hasConceptScore W2033341036C177564732 @default.
- W2033341036 hasConceptScore W2033341036C192562407 @default.
- W2033341036 hasConceptScore W2033341036C204530211 @default.
- W2033341036 hasConceptScore W2033341036C2779227376 @default.
- W2033341036 hasConceptScore W2033341036C31258907 @default.
- W2033341036 hasConceptScore W2033341036C33574316 @default.
- W2033341036 hasConceptScore W2033341036C41008148 @default.
- W2033341036 hasConceptScore W2033341036C43214815 @default.
- W2033341036 hasConceptScore W2033341036C49040817 @default.
- W2033341036 hasConceptScore W2033341036C50296614 @default.
- W2033341036 hasConceptScore W2033341036C530198007 @default.
- W2033341036 hasConceptScore W2033341036C544956773 @default.
- W2033341036 hasConceptScore W2033341036C59088047 @default.
- W2033341036 hasConceptScore W2033341036C62520636 @default.
- W2033341036 hasConceptScore W2033341036C68928338 @default.
- W2033341036 hasConceptScore W2033341036C79072407 @default.
- W2033341036 hasLocation W20333410361 @default.
- W2033341036 hasOpenAccess W2033341036 @default.
- W2033341036 hasPrimaryLocation W20333410361 @default.
- W2033341036 hasRelatedWork W1961878373 @default.
- W2033341036 hasRelatedWork W2045684767 @default.
- W2033341036 hasRelatedWork W2070713558 @default.
- W2033341036 hasRelatedWork W2119842981 @default.
- W2033341036 hasRelatedWork W2158958472 @default.
- W2033341036 hasRelatedWork W2262563805 @default.
- W2033341036 hasRelatedWork W2280843282 @default.
- W2033341036 hasRelatedWork W2532553300 @default.