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- W2033380914 abstract "A thermal flow sensor which has been bulk micromachined from a high-resistivity (, n-type) silicon wafer is herein reported. A structurally and functionally complex sensing element has been fabricated, using standard etching and deposition techniques, which demonstrates a very high degree of thermal isolation, as well as uniquely enhanced sensitivity characteristics. This device is explored primarily from a structural point of view to illustrate the formation of silicon nitride bridges, in the form of `chevrons', which provide its thermal isolation." @default.
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- W2033380914 date "1996-06-01" @default.
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- W2033380914 title "Structural design and characteristics of a thermally isolated, sensitivity-enhanced, bulk-micromachined, silicon flow sensor" @default.
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- W2033380914 doi "https://doi.org/10.1088/0960-1317/6/2/003" @default.
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