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- W2034002059 abstract "This paper describes a method that contains a series of processes for producing three-dimensional (3-D) microstructures with a feature size in the submicrometer scale. It starts from using a metal contact printing lithography to pattern a thin metal film on the surface of a (100) silicon substrate. The metal film has a hole-array pattern with a hole diameter ranging from 300 nm to 800 nm and is used as an etching mask for silicon bulk machining to create concave pyramid-shaped surface microstructures. Using this bulk-machined silicon substrate as a template, polymer 3-D microstructures are replicated on top of a silicon dioxide (SiO2) layer. Finally, through a dry etching process, 3-D microstructures with a profile similar to the replicated polymer microstructures are formed on the SiO2 layer. Potential applications of these fabricated SiO2 microstructures in the light-emitting diode industry will be addressed." @default.
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- W2034002059 date "2014-05-21" @default.
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- W2034002059 title "Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining" @default.
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- W2034002059 doi "https://doi.org/10.1117/1.jmm.13.2.023008" @default.
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