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- W2034065089 abstract "Deep-UV (240-250 nm) lithography is of one the most promising new lithographic techniques for patterning devices with 0.35-0.5 μm structures. Chemically amplified resists have been reported to meet the necessary requirements of both excimer laser and Hg source-based exposure tools. The chemistry of one family of these materials involves the photogeneration of organic acid catalysts from 2,6-dinitrobenzyl esters, which, upon mild heating, effect the removal of a t-butoxy carbonyl protecting group from poly(t-butoxycarbonyloxy-α-methylstyrene), [poly(t-BOC-α-methylstyrene)]. The thermal behavior of the esters has been examined, and the quantum yield determined for selected examples. A lithographic evaluation of resists based upon several organic ester acid precursors and poly(t-BOC-α-methylstyrene) has been made. Sensitivities ranging from 2 to 100 mJ/cm<sup>2</sup> in the deep-UV region have been observed, and 0.5 μm resolution has been demonstrated, using a contact printer equipped with a 248 nm laser source." @default.
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- W2034065089 date "1989-08-22" @default.
- W2034065089 modified "2023-09-23" @default.
- W2034065089 title "Chemically Amplified Resists: A Lithographic Comparison of Acid Generating Species." @default.
- W2034065089 doi "https://doi.org/10.1117/12.953012" @default.
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