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- W2034292254 abstract "Manufacturing tools may process wafers in different fashions: by group of lots, by lot, by group of wafers, one- by-one in single or multichamber tools,... The order sequence in which wafers are processed in a given step of the manufacturing routing can be used as a valuable source for yield improvement. Within this scope we published on SPIE's 1996 Microelectronic Manufacturing an Advanced Software System to correlate order-sequences versus any yield related metric. Since then we have developed a new generation of Software named POSISCAN which automates the analysis and detection of 'order patterns', that is, footprints of the yield being impacted by the order in which the wafers were processed in a specific tool. Yield degradation induced on each process can have a kind of footprint. We have accumulated a wealth of these footprints and developed a very fine knowledge-based algorithm to automatically detect them on every lot. The effectiveness of this automated POSISCAN tool is remarkably high and is having a big impact on time to detection/analysis/root-cause of yield loss." @default.
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- W2034292254 date "1998-08-28" @default.
- W2034292254 modified "2023-09-26" @default.
- W2034292254 title "Yield improvement via automatic analysis of wafer-processing order" @default.
- W2034292254 doi "https://doi.org/10.1117/12.324372" @default.
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