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• W2034386622 abstract "Bottom-up feature fill, also called superfill, of gold is demonstrated for the first time. Gold superfill is achieved in trenches as narrow as 60 nm, particularly relevant for interconnects on GaAs and GaN technologies. This was accomplished through the use of submonolayer coverage of a preadsorbed, deposition-rate accelerating surfactant followed by Au electrodeposition. The experimental results indicate the potential of this technologically relevant process and also support the generality of the CEAC mechanism for feature superfill and surface stabilization. © 2005 The Electrochemical Society. All rights reserved." @default.
• W2034386622 created "2016-06-24" @default.
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• W2034386622 date "2005-01-01" @default.
• W2034386622 modified "2023-09-23" @default.
• W2034386622 title "Gold Superfill in Sub-Micrometer Trenches" @default.
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• W2034386622 doi "https://doi.org/10.1149/1.1854777" @default.
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