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- W2034568123 abstract "We have developed 100mm in diameter 4H-SiC/poly-SiC bonded wafer by SAB method. The SiC bonded wafer demonstrated an excellent thermal stability against device processing temperature. SBDs fabricated on the SiC bonded wafer exhibited good I-V characteristics. These results suggest that it is a promising alternative wafer for SiC power device." @default.
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- W2034568123 date "2014-07-01" @default.
- W2034568123 modified "2023-09-23" @default.
- W2034568123 title "100 mm diameter mono-crystalline 4H-SiC/polycrystalline-SiC bonded wafers fabricated by SAB for power device" @default.
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- W2034568123 doi "https://doi.org/10.1109/ltb-3d.2014.6886195" @default.
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