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- W2034742262 abstract "We present a new method for measuring thermal conductivities of films with nanoscale thickness. The method combines a microelectrothermal test structure with a finite-element-based data analysis procedure. The test device consists of two serpentine nickel structures, which serve as resistive heaters and resistance temperature detectors, on top of the sample. The sample is supported by a silicon nitride membrane. Analytical solution of the heat flow is infeasible, making interpretation of the data difficult. To address this, we use a finite-element model of the test structure, and apply nonlinear least-squares estimation to extract the desired material parameter values. The approach permits simultaneous extraction of multiple parameters. We demonstrate our technique by simultaneously obtaining the thermal conductivity of a 280 μm by 80 μm by 140 nm thick aluminum sample and the 360 μm by 160 μm by 180 nm thick silicon nitride support membrane. The thermal conductivity measured for the silicon nitride thin film is 2.1 W/mK, in agreement with reported values for films of this thickness. The thermal conductivity of the Al thin film is found to be 94 W/mK—significantly lower than reported bulk values, and consistent both with reported trends for thin metallic films and with values obtained using electrical resistivity measurements and the Wiedemann-Franz law." @default.
- W2034742262 created "2016-06-24" @default.
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- W2034742262 date "2007-01-01" @default.
- W2034742262 modified "2023-09-25" @default.
- W2034742262 title "Model-Based Data Analysis for Thin-Film Thermal Conductivity Measurement Using Microelectrothermal Test Structures" @default.
- W2034742262 doi "https://doi.org/10.1115/imece2007-42750" @default.
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