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- W2034783950 abstract "Abstract We have deposited Cu films on Si(111) substrates by utilizing ionized Cu clusters. The surface and interface characteristics of these films were investigated. The interdiffusion between Cu and Si atoms after annealing in vacuum was found to be very small. The interdiffusion decreased with increasing acceleration voltage, which corresponds to the dependence of the (111) preferential orientation on the acceleration voltage. The diffusion coefficient obtained at 230 ° C was 4 × 10 −14 cm 2 /s for the case of V a = 5 kV; it was smaller than one tenth in comparison to films prepared by using neutral Cu clusters. When Cu films were deposited on a Si(100) substrate, the diffusion coefficient was smallest at V a = 3 kV, and its dependence on the acceleration voltage corresponded to that of the (100) preferential orientation." @default.
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- W2034783950 date "1989-02-01" @default.
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- W2034783950 title "Grain boundary diffusion control of Cu films prepared by the ICB technique" @default.
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- W2034783950 doi "https://doi.org/10.1016/0168-583x(89)90320-0" @default.
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