FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2034789080> ?p ?o ?g. }

• W2034789080 endingPage "36" @default.
• W2034789080 startingPage "30" @default.
• W2034789080 abstract "Purpose The purpose of this paper is to investigate the effects of minor addition of the rare earth (RE) element cerium, Ce, on the microstructures and creep properties of Sn-Ag-Cu solder alloys. Design/methodology/approach The pure Sn, Sn-Cu alloy, Sn-Ag alloy and Cu-Ce alloy were used as raw materials. Sn-Ag-Cu alloys with different contents of RE Ce were chosen to compare with Sn-Ag-Cu. The raw materials of Sn, Sn-Cu alloy, Sn-Ag alloy, Cu-Ce alloy were melted in a ceramic crucible, and were melted at 550°C ± 1°C for 40 minutes. To homogenize the solder alloy, mechanical stirring was performed every ten minutes using a glass rod. During the melting, KC1 + LiCI (1.3:1), were used over the surface of liquid solder to prevent oxidation. The melted solder was chill cast into a rod. Findings It is found that the microstructure exhibits smaller grains and the Ag 3 Sn/Cu 6 Sn 5 intermetallic compound (IMC) phases are modified in matrix with the addition of Ce. In particular, the addition of 0.03 wt.% Ce to the Sn-Ag-Cu solder can refine the microstructures and decrease the thickness of the IMC layers of Sn-Ag-Cu solder alloys. Meanwhile, thermodynamic analysis showed that these phenomena could be attributed to the reduction of the driving force for Cu-Sn IMC formation due to the addition of Ce. Results calculated using the thermodynamic method are close to the above experimental data. Thus, the optimum content of Ce in Sn-Ag-Cu solder alloys should be about 0.030 percent. Additionally, the effect of Ce on the creep rupture life of Sn-Ag-Cu soldered joints was studied. It was found that the creep rupture life may be increased up to 7.5 times more than that of the original Sn-Ag-Cu alloy, when Ce accounts for 0.030 percent. Originality/value This paper usefully investigates the effects of the RE cerium (Ce), on the microstructures and creep properties of Sn-Ag-Cu solder alloys, optimizing the quantity of Ce in the Sn-Ag-Cu solder alloy through a thermodynamic method and by creep-rupture life testing." @default.
• W2034789080 created "2016-06-24" @default.
• W2034789080 creator A5009580095 @default.
• W2034789080 creator A5037458498 @default.
• W2034789080 creator A5065458315 @default.
• W2034789080 creator A5066599847 @default.
• W2034789080 creator A5080232501 @default.
• W2034789080 creator A5080368842 @default.
• W2034789080 creator A5089333139 @default.
• W2034789080 date "2010-04-13" @default.
• W2034789080 modified "2023-09-29" @default.
• W2034789080 title "Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium" @default.
• W2034789080 cites W1964356148 @default.
• W2034789080 cites W1965383034 @default.
• W2034789080 cites W1975254559 @default.
• W2034789080 cites W1976013042 @default.
• W2034789080 cites W1996270776 @default.
• W2034789080 cites W2008255636 @default.
• W2034789080 cites W2010001525 @default.
• W2034789080 cites W2025749998 @default.
• W2034789080 cites W2031168357 @default.
• W2034789080 cites W2046257090 @default.
• W2034789080 cites W2057186436 @default.
• W2034789080 cites W2058891133 @default.
• W2034789080 cites W2061473707 @default.
• W2034789080 cites W2062476281 @default.
• W2034789080 cites W2064621580 @default.
• W2034789080 cites W2068777327 @default.
• W2034789080 cites W2078787413 @default.
• W2034789080 cites W2088081976 @default.
• W2034789080 cites W2108007629 @default.
• W2034789080 cites W2117230235 @default.
• W2034789080 cites W2120074145 @default.
• W2034789080 cites W3148701085 @default.
• W2034789080 doi "https://doi.org/10.1108/09540911011036262" @default.
• W2034789080 hasPublicationYear "2010" @default.
• W2034789080 type Work @default.
• W2034789080 sameAs 2034789080 @default.
• W2034789080 citedByCount "20" @default.
• W2034789080 countsByYear W20347890802012 @default.
• W2034789080 countsByYear W20347890802013 @default.
• W2034789080 countsByYear W20347890802014 @default.
• W2034789080 countsByYear W20347890802015 @default.
• W2034789080 countsByYear W20347890802016 @default.
• W2034789080 countsByYear W20347890802017 @default.
• W2034789080 countsByYear W20347890802019 @default.
• W2034789080 countsByYear W20347890802020 @default.
• W2034789080 countsByYear W20347890802022 @default.
• W2034789080 crossrefType "journal-article" @default.
• W2034789080 hasAuthorship W2034789080A5009580095 @default.
• W2034789080 hasAuthorship W2034789080A5037458498 @default.
• W2034789080 hasAuthorship W2034789080A5065458315 @default.
• W2034789080 hasAuthorship W2034789080A5066599847 @default.
• W2034789080 hasAuthorship W2034789080A5080232501 @default.
• W2034789080 hasAuthorship W2034789080A5080368842 @default.
• W2034789080 hasAuthorship W2034789080A5089333139 @default.
• W2034789080 hasConcept C120500152 @default.
• W2034789080 hasConcept C147597530 @default.
• W2034789080 hasConcept C149912024 @default.
• W2034789080 hasConcept C18168003 @default.
• W2034789080 hasConcept C185592680 @default.
• W2034789080 hasConcept C191897082 @default.
• W2034789080 hasConcept C192562407 @default.
• W2034789080 hasConcept C27501479 @default.
• W2034789080 hasConcept C2780026712 @default.
• W2034789080 hasConcept C50296614 @default.
• W2034789080 hasConcept C523597863 @default.
• W2034789080 hasConcept C87976508 @default.
• W2034789080 hasConceptScore W2034789080C120500152 @default.
• W2034789080 hasConceptScore W2034789080C147597530 @default.
• W2034789080 hasConceptScore W2034789080C149912024 @default.
• W2034789080 hasConceptScore W2034789080C18168003 @default.
• W2034789080 hasConceptScore W2034789080C185592680 @default.
• W2034789080 hasConceptScore W2034789080C191897082 @default.
• W2034789080 hasConceptScore W2034789080C192562407 @default.
• W2034789080 hasConceptScore W2034789080C27501479 @default.
• W2034789080 hasConceptScore W2034789080C2780026712 @default.
• W2034789080 hasConceptScore W2034789080C50296614 @default.
• W2034789080 hasConceptScore W2034789080C523597863 @default.
• W2034789080 hasConceptScore W2034789080C87976508 @default.
• W2034789080 hasIssue "2" @default.
• W2034789080 hasLocation W20347890801 @default.
• W2034789080 hasOpenAccess W2034789080 @default.
• W2034789080 hasPrimaryLocation W20347890801 @default.
• W2034789080 hasRelatedWork W1919346256 @default.
• W2034789080 hasRelatedWork W1982647845 @default.
• W2034789080 hasRelatedWork W1987487801 @default.
• W2034789080 hasRelatedWork W2002199820 @default.
• W2034789080 hasRelatedWork W2089251307 @default.
• W2034789080 hasRelatedWork W2243753983 @default.
• W2034789080 hasRelatedWork W2247625574 @default.
• W2034789080 hasRelatedWork W2360487249 @default.
• W2034789080 hasRelatedWork W2528998499 @default.
• W2034789080 hasRelatedWork W2771277520 @default.
• W2034789080 hasVolume "22" @default.
• W2034789080 isParatext "false" @default.
• W2034789080 isRetracted "false" @default.
• W2034789080 magId "2034789080" @default.

• next