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• W2034843657 abstract "We report the flip-chip bonding of a 16/spl times/16 array of 970-nm vertical-cavity surface-emitting lasers (VCSELs) to an array of silicon CMOS driver circuits. The small-signal bandwidth of a flip-chip bonded VCSEL is in excess of 4 GHz. Individual VCSELs are capable of being modulated by the CMOS circuits at 1 Gb/s. The thermal impedance of the flip-chip bonded VCSELs is 1/spl deg/C/mW. The measured crosstalk suppression between channels is approximately 20 dB. Simultaneous parallel testing of up to 80 VCSELs at 1 Gb/s per VCSEL is demonstrated." @default.
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• W2034843657 date "2000-08-01" @default.
• W2034843657 modified "2023-10-14" @default.
• W2034843657 title "16 x 16 VCSEL array flip-chip bonded to CMOS VLSI circuit" @default.
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• W2034843657 doi "https://doi.org/10.1109/68.868012" @default.
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