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• W2034985658 abstract "The influence of a catalyst deactivating leveling additive in electrodeposition is explored in the context of the previously developed curvature enhanced accelerator coverage model of superconformal film growth. Competitive adsorption between a rapidly adsorbed suppressor, rate accelerating catalyst, and catalyst-deactivating leveler is examined. Rate equations are formulated where the leveling agent is capable of deactivating the adsorbed catalyst by either direct adsorption from the electrolyte or by deactivation/displacement during surface area reduction that accompanies advancing concave surfaces. The influence of a prototypical cationic surfactant leveler on electrochemical kinetics and feature filling is examined for copper electrodeposition from an electrolyte containing polyethylene glycol-chloride-bis(3-sulfopropyl)disulfide (PEG-Cl-SPS)." @default.
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• W2034985658 date "2006-01-01" @default.
• W2034985658 modified "2023-10-17" @default.
• W2034985658 title "Curvature Enhanced Adsorbate Coverage Model for Electrodeposition" @default.
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• W2034985658 doi "https://doi.org/10.1149/1.2165580" @default.
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