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• W2035165418 abstract "The Ni-P alloy [or Ni(P)] with a 6-13 wt.% P content is a very common surface finishing material used in microelectronic packages. When a high P-content Ni(P) finish (≃13 wt.%) was jointed to the Sn-based solders, there are several possible P-containing intermetallics, e.g., Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> SnP, Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> P, Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>12</sub> P <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</sub> , and Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> P, can form at the interface. Among these intermetallics, the Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> SnP layer played a major role in intermetallic compound (IMC) spalling behavior that has become a serious reliability concern of solder joints. Very recently, we found that the Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> SnP can also form in a low P-content Ni(P) case (≃7 wt.%) if an additional Pd(P) layer was deposited above. It is hypothesized that the P element within the Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> SnP resulted from the separation of P atoms from the Pd(P) layer as the Pd was converted into PdSn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sub> [or (Pd, Ni)Sn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sub> ] during soldering. The remaining P then reacted with Ni and Sn, forming a Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> SnP layer at the interface. However, there is no direct proof to support this view. To simply the solder/Au/Pd(P)/Ni(P) interfacial reaction and to clarify the validity of the Ni <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> SnP formation mechanism aforementioned, soldering reactions between a Sn3Ag0.5Cu (96.5 wt.% Sn -3 wt.% Ag -0.5 wt.% Cu) alloy and a Au/Pd(P)/electrolytic-Ni tri-layer structure were investigated in this study. The results of this study showed that a layer of P-containing compound grew at the interface immediately after the Pd was converted into (Pd, Ni)Sn <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sub> . This verified the hypothesis made previously. A more detailed analysis on the reaction kinetics about the Sn3Ag0.5Cu alloy with the Au/Pd(P)/electrolytic-Ni, and the possible reliability concern arising from the Pd(P) layer will be presented in this study." @default.
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• W2035165418 date "2010-10-01" @default.
• W2035165418 modified "2023-09-28" @default.
• W2035165418 title "A study on the soldering reaction between Sn3Ag0.5Cu and electrolytic-Ni coated with a Au/Pd(P) bilayer surface finish" @default.
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• W2035165418 doi "https://doi.org/10.1109/impact.2010.5699578" @default.
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