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• W2035351104 startingPage "580" @default.
• W2035351104 abstract "Polyimide (PI) is an excellent functional material, which possesses desirable properties of high temperature resistance, good mechanical strength and so on; but it is hard to serve as a substrate deposited with metal films due to the inferior adhesion force between PI and metal films; surface modification method is one of the best ways to solve this technique problem. In this paper, surface of PI film was treated by home-made MEVVA and FCVA systems to improve the adhesion strength to metal coatings; specimens were pretreated by three different fluences of Ni ion plasma. PI deposited with a tie layer was analyzed by XRD to examine the as-deposited Cu films structure; the morphology of specimens were investigated by scanning electron microscopy (SEM), characteristic absorption peaks of modified PI films were depicted by Fourier Transform Infrared spectrum (FTIR). The simulation of PI films implanted with Ni ions with different fluences was also carried out by TRIDYN codes; the depth profile of Ni atoms distribution was obtained." @default.
• W2035351104 created "2016-06-24" @default.
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• W2035351104 date "2013-07-01" @default.
• W2035351104 modified "2023-09-28" @default.
• W2035351104 title "The study of polyimide modified by Ni plasma and its adhesion to Cu films" @default.
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• W2035351104 doi "https://doi.org/10.1016/j.nimb.2012.11.064" @default.
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