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- W2035777772 abstract "Electromigration void behavior in Al-0.1%Sc and Al-0.5%Cu alloys was compared by conducting tests in a High Voltage Scanning Electron Microscope (HVSEM). Wafer level test results showed that the median time to failure for the Al-Cu lines was ten times longer than that of the Al-Sc lines. In-situ tests of the two alloys showed a similarity in void nucleation times but differences in void movement between the two sample sets; the interactions of voids with Al2Cu theta precipitates in Al-Cu lines were especially interesting. From our studies, it appeared that the addition of scandium to Al does not have the proposed benefits for electromigration resistance, as suggested by previous studies." @default.
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- W2035777772 date "1998-01-01" @default.
- W2035777772 modified "2023-09-26" @default.
- W2035777772 title "Comparison of electromigration behavior in passivated aluminum interconnects" @default.
- W2035777772 doi "https://doi.org/10.1063/1.54632" @default.
- W2035777772 hasPublicationYear "1998" @default.
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