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• W2036435230 abstract "A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna's reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations." @default.
• W2036435230 created "2016-06-24" @default.
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• W2036435230 date "2011-11-01" @default.
• W2036435230 modified "2023-09-26" @default.
• W2036435230 title "Effects of wafer-level packaging on millimetre-wave antennas" @default.
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• W2036435230 doi "https://doi.org/10.1109/lapc.2011.6113964" @default.
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