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• W2036636612 abstract "Plastic encapsulated microelectronics (PEMs) has found wide spread applications in automotive environments for varied roles. Transition to hybrid electric vehicles and fully electric vehicles has increased the trend towards greater integration of electronics in automotive under hood environments. Electronics in such applications may be mounted directly on engine and on transmission. Electronics under hood may be subjected to temperatures in neighborhood of 200°C. Commercially available PEMs are able to operate in the neighborhood of 175°C. However, sustained operation at temperatures of 200°C or higher is beyond the state of art. Materials and processing techniques needed for sustained high temperature operation for 10 years and 100,000 miles of vehicle operation are yet unknown. There is need for studies for understanding the failure mechanisms of PEMs at sustained high temperature. In this paper, new approach is discussed to study physical and chemical stability of molding compound when it is subjected to very high temperature for prolonged duration. Four mold compound candidates were selected for test purpose. They were subjected to thermal aging at 200°C and 250°C, for 5000 hours. For degradation study, bulk mold compound specimens as well as 20 pin SOIC devices, encapsulated with MC candidates were used. Test vehicle was bonded with gold wires, and Pd coated Al pad. For bulk mold compound samples, weight loss test, DMA, FTIR, XPS tests were performed at fixed time intervals. To study integrity of SOIC devices, resistance spectroscopy, x-ray inspection and current leakage tests were selected. Another set was subjected to 120 hours of aging at 130°C/100%RH condition to check leakage current. Performance of MC candidates at high temperature was evaluated using all these tests. Sensitivity of each test towards detecting degradation of EMC's is also discussed and most effective tests are suggested." @default.
• W2036636612 created "2016-06-24" @default.
• W2036636612 creator A5010757672 @default.
• W2036636612 creator A5046297628 @default.
• W2036636612 creator A5067146707 @default.
• W2036636612 creator A5068741078 @default.
• W2036636612 creator A5085405957 @default.
• W2036636612 creator A5088467503 @default.
• W2036636612 date "2014-05-01" @default.
• W2036636612 modified "2023-09-25" @default.
• W2036636612 title "Degradation mechanisms in electronic mold compounds subjected to high temperature in neighborhood of 200&#x00B0;C" @default.
• W2036636612 cites W1994272211 @default.
• W2036636612 cites W2044727435 @default.
• W2036636612 cites W2057102074 @default.
• W2036636612 cites W2069106457 @default.
• W2036636612 cites W2073062854 @default.
• W2036636612 cites W2082174519 @default.
• W2036636612 cites W2101001280 @default.
• W2036636612 cites W2103030068 @default.
• W2036636612 cites W2103668244 @default.
• W2036636612 cites W2134299068 @default.
• W2036636612 cites W2142004938 @default.
• W2036636612 cites W2155620478 @default.
• W2036636612 cites W2163544144 @default.
• W2036636612 cites W2498349512 @default.
• W2036636612 cites W2566255301 @default.
• W2036636612 doi "https://doi.org/10.1109/ectc.2014.6897295" @default.
• W2036636612 hasPublicationYear "2014" @default.
• W2036636612 type Work @default.
• W2036636612 sameAs 2036636612 @default.
• W2036636612 citedByCount "7" @default.
• W2036636612 countsByYear W20366366122015 @default.
• W2036636612 countsByYear W20366366122016 @default.
• W2036636612 countsByYear W20366366122017 @default.
• W2036636612 countsByYear W20366366122020 @default.
• W2036636612 countsByYear W20366366122021 @default.
• W2036636612 countsByYear W20366366122023 @default.
• W2036636612 crossrefType "proceedings-article" @default.
• W2036636612 hasAuthorship W2036636612A5010757672 @default.
• W2036636612 hasAuthorship W2036636612A5046297628 @default.
• W2036636612 hasAuthorship W2036636612A5067146707 @default.
• W2036636612 hasAuthorship W2036636612A5068741078 @default.
• W2036636612 hasAuthorship W2036636612A5085405957 @default.
• W2036636612 hasAuthorship W2036636612A5088467503 @default.
• W2036636612 hasConcept C119599485 @default.
• W2036636612 hasConcept C127413603 @default.
• W2036636612 hasConcept C138331895 @default.
• W2036636612 hasConcept C146978453 @default.
• W2036636612 hasConcept C159985019 @default.
• W2036636612 hasConcept C171250308 @default.
• W2036636612 hasConcept C175708663 @default.
• W2036636612 hasConcept C187937830 @default.
• W2036636612 hasConcept C192562407 @default.
• W2036636612 hasConcept C2778520156 @default.
• W2036636612 hasConcept C2779679103 @default.
• W2036636612 hasConcept C2780566776 @default.
• W2036636612 hasConcept C42360764 @default.
• W2036636612 hasConcept C526921623 @default.
• W2036636612 hasConcept C59061564 @default.
• W2036636612 hasConcept C67558686 @default.
• W2036636612 hasConceptScore W2036636612C119599485 @default.
• W2036636612 hasConceptScore W2036636612C127413603 @default.
• W2036636612 hasConceptScore W2036636612C138331895 @default.
• W2036636612 hasConceptScore W2036636612C146978453 @default.
• W2036636612 hasConceptScore W2036636612C159985019 @default.
• W2036636612 hasConceptScore W2036636612C171250308 @default.
• W2036636612 hasConceptScore W2036636612C175708663 @default.
• W2036636612 hasConceptScore W2036636612C187937830 @default.
• W2036636612 hasConceptScore W2036636612C192562407 @default.
• W2036636612 hasConceptScore W2036636612C2778520156 @default.
• W2036636612 hasConceptScore W2036636612C2779679103 @default.
• W2036636612 hasConceptScore W2036636612C2780566776 @default.
• W2036636612 hasConceptScore W2036636612C42360764 @default.
• W2036636612 hasConceptScore W2036636612C526921623 @default.
• W2036636612 hasConceptScore W2036636612C59061564 @default.
• W2036636612 hasConceptScore W2036636612C67558686 @default.
• W2036636612 hasLocation W20366366121 @default.
• W2036636612 hasOpenAccess W2036636612 @default.
• W2036636612 hasPrimaryLocation W20366366121 @default.
• W2036636612 hasRelatedWork W1570696729 @default.
• W2036636612 hasRelatedWork W1590849965 @default.
• W2036636612 hasRelatedWork W1595593041 @default.
• W2036636612 hasRelatedWork W1845413245 @default.
• W2036636612 hasRelatedWork W1925980675 @default.
• W2036636612 hasRelatedWork W1978380643 @default.
• W2036636612 hasRelatedWork W2075714738 @default.
• W2036636612 hasRelatedWork W2088156170 @default.
• W2036636612 hasRelatedWork W2096003559 @default.
• W2036636612 hasRelatedWork W2099976566 @default.
• W2036636612 hasRelatedWork W2147652579 @default.
• W2036636612 hasRelatedWork W2165549046 @default.
• W2036636612 hasRelatedWork W2166979063 @default.
• W2036636612 hasRelatedWork W2214837564 @default.
• W2036636612 hasRelatedWork W2317486629 @default.
• W2036636612 hasRelatedWork W2412527529 @default.
• W2036636612 hasRelatedWork W2543569835 @default.
• W2036636612 hasRelatedWork W2970722102 @default.
• W2036636612 hasRelatedWork W3048334956 @default.
• W2036636612 hasRelatedWork W3140709904 @default.
• W2036636612 isParatext "false" @default.

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