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- W2036701354 abstract "The capacities of a new ‘all-dry’ resist system for in situ microstructuring have been investigated. The system consists of a 1000 nm thick vacuum deposited polymer (polyimide) layer and a 40 nm thick E-beam evaporated carbide (TiC or B4C) film. The bilayer system is patterned in situ in two stages. The microstructuring of the carbide film is carried out by a single pulse excimer laser exposure at threshold fluencies of 27 mJ/cm2 and 23 mJ/cm2 for TiC and B4C, respectively. The laser generated image is transferred into the bottom polyimide layer by reactive ion etching in an O2 ambience.The proposed all-dry lithographic system provides an attractive scientific and technological basis for the integrated microstructuring processes, easily adaptable to the existing microelectronic technologies." @default.
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- W2036701354 date "1997-01-01" @default.
- W2036701354 modified "2023-09-27" @default.
- W2036701354 title "‘All-dry’ and in situ microstructuring of carbide/polyimide layers" @default.
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- W2036701354 doi "https://doi.org/10.1016/s0042-207x(96)00231-x" @default.
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