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- W2037133721 abstract "This paper describes the effect of low-pressure collimated sputtering (LPCS) on deposition rates, step coverages, and electrical properties of Al-Cu. The LPCS deposition is achieved in a magnetron sputter deposition system with a hollow cathode and collimator. The deposition results show that as the via or line size reduces, a complete fill requires a monotonic increase in the aspect ratio of the collimator which limits the throughput for a thick deposition, especially at high pressures (≳1 mT). The benefit of the LPCS is the improved deposition rate (scaled to power) of 1.5–2× compared to the conventional high-pressure collimated deposition. The integration of LPCS process to fabricate a two-level Al-Cu metal structure with submicron Al-Cu studs (aspect ratio of 2) shows excellent via and electromigration resistances." @default.
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- W2037133721 date "1995-05-08" @default.
- W2037133721 modified "2023-09-25" @default.
- W2037133721 title "Formation of Al‐Cu via/interconnect by low‐pressure collimated sputtering" @default.
- W2037133721 doi "https://doi.org/10.1063/1.114003" @default.
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