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- W2037171084 abstract "Formation and morphology of the intermetallic compounds (IMCs) formed at the 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface has been studied using X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and electron diffraction (ED). The XRD analysis indicates that the γ-Cu5Zn8 IMC is found at the solder/Cu interface in the as-wetted sample. When heat treated at 423 K for 100 or 400 h, the IMC phases still remain as γ-Cu5Zn8 and Cu6Sn5. As the aging time increases from 400 to 1000 h, besides γ-Cu5Zn8 and Cu6Sn5, γ′-Cu9Al4 also appears. Planar-shaped γ-Cu5Zn8 and Cu6Sn5 are found near the solder and the Cu substrate, respectively. However, scallop-shaped γ-Cu5Zn8 is found at the eutectic 91Sn–8.55Zn–0.45Al solder alloy/Cu interface when aged at 423 K." @default.
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- W2037171084 date "2005-03-01" @default.
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- W2037171084 title "Formation and morphology of the intermetallic compounds formed at the 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface" @default.
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- W2037171084 doi "https://doi.org/10.1016/j.jallcom.2004.08.009" @default.
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