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- W2037223888 abstract "Even though light-emitting diodes may have a very long life, poorly designed LED lamp can experience a short life. A simulation of temperature distribution of four chips high-power LED down-light was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the height of the heat sink on the junction temperature were made, which provide an effective reference for the thermal design." @default.
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- W2037223888 date "2011-09-01" @default.
- W2037223888 modified "2023-09-23" @default.
- W2037223888 title "Thermal analysis for high-power LED down-light" @default.
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- W2037223888 doi "https://doi.org/10.1109/icecc.2011.6066674" @default.
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