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- W2037353413 abstract "A new technique to measure the thermal conductivity k(T)of CVD diamond is presented. The thermal conductivity parallel to the surface of films with thicknesses ranging from 2 μm up to several hundred μm can be determined over a wide temperature range. The measurements are carried out with micromechanical devices, that are fabricated by standard thin film technology. Patterning of the diamond film has been performed in an oxygen plasma. A thin film heater generates a temperature profile which is measured by several thermoresistors. Measured values of the thermal conductivity of single crystalline silicon show a very good agreement with literature results. The thermal conductivities of diamond films with thicknesses between 3. 6 and 8 μm grown on a silicon substrate by the hot filament technique with different methane concentrations have been measured between −195 and 300°C. The measured values range between less than 1 W/cm K for −195°C and 5 W/cm K for room temperature." @default.
- W2037353413 created "2016-06-24" @default.
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- W2037353413 date "1996-03-16" @default.
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- W2037353413 title "Measurements of the Thermal Conductivity of CVD Diamond Films Using Micromechanical Devices" @default.
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- W2037353413 doi "https://doi.org/10.1002/pssa.2211540128" @default.
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