Matches in SemOpenAlex for { <https://semopenalex.org/work/W2037901402> ?p ?o ?g. }
Showing items 1 to 84 of
84
with 100 items per page.
- W2037901402 abstract "The necessity to decrease silicon wafer-processing temperatures substantially has stimulated research into new and innovative technique for the formation of thin dielectric films. A photo-decomposition technique using nitric oxide (NO) is one such promising method. Thermally NO-grown and NO-annealed dielectric films have already shown very encouraging physical and electrical properties. The purpose of this study is to investigate the effect of UV irradiation on the growth kinetics and on the electrical and physical characteristics of these thin dielectrics and to simulate the decomposition of NO molecules that occurs thermally above 1000 degrees C. Methods using UV and vacuum UV light generated from low-pressure mercury or deuterium lamps to stimulate the growth of ultrathin dielectric films are described. Thin dielectrics were prepared by irradiating a UV beam on the heated silicon substrate covered by a thin layer of nitric oxide gas at different temperatures for various lengths of time. The films grown under the low- pressure mercury lamp displayed a much faster growth rate than under the deuterium lamp. The electrical characteristics of the films grown using a deuterium lamp show encouraging results compared to the low-pressure mercury. Compositions of the various dielectrics formed under the two UV sources were studied using x-ray photoelectron spectroscopy (XPS). MIS devices were fabricated using these films as gate insulators and were electrically characterized. Electrical and physical characterization revealed good film qualities, rendering this new UV-NO dielectric growth technique promising for low temperature semiconductor processing.© (1999) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only." @default.
- W2037901402 created "2016-06-24" @default.
- W2037901402 creator A5018601401 @default.
- W2037901402 creator A5036074930 @default.
- W2037901402 creator A5039482466 @default.
- W2037901402 creator A5059494887 @default.
- W2037901402 creator A5066812595 @default.
- W2037901402 creator A5088267249 @default.
- W2037901402 date "1999-10-01" @default.
- W2037901402 modified "2023-09-27" @default.
- W2037901402 title "<title>Stress effect on the via crack of IMD structure in scrubber processing</title>" @default.
- W2037901402 doi "https://doi.org/10.1117/12.364507" @default.
- W2037901402 hasPublicationYear "1999" @default.
- W2037901402 type Work @default.
- W2037901402 sameAs 2037901402 @default.
- W2037901402 citedByCount "0" @default.
- W2037901402 crossrefType "proceedings-article" @default.
- W2037901402 hasAuthorship W2037901402A5018601401 @default.
- W2037901402 hasAuthorship W2037901402A5036074930 @default.
- W2037901402 hasAuthorship W2037901402A5039482466 @default.
- W2037901402 hasAuthorship W2037901402A5059494887 @default.
- W2037901402 hasAuthorship W2037901402A5066812595 @default.
- W2037901402 hasAuthorship W2037901402A5088267249 @default.
- W2037901402 hasConcept C113196181 @default.
- W2037901402 hasConcept C119599485 @default.
- W2037901402 hasConcept C127413603 @default.
- W2037901402 hasConcept C133386390 @default.
- W2037901402 hasConcept C160671074 @default.
- W2037901402 hasConcept C165801399 @default.
- W2037901402 hasConcept C166972891 @default.
- W2037901402 hasConcept C171250308 @default.
- W2037901402 hasConcept C172385210 @default.
- W2037901402 hasConcept C175708663 @default.
- W2037901402 hasConcept C185592680 @default.
- W2037901402 hasConcept C19067145 @default.
- W2037901402 hasConcept C192562407 @default.
- W2037901402 hasConcept C42360764 @default.
- W2037901402 hasConcept C43617362 @default.
- W2037901402 hasConcept C49040817 @default.
- W2037901402 hasConcept C544956773 @default.
- W2037901402 hasConceptScore W2037901402C113196181 @default.
- W2037901402 hasConceptScore W2037901402C119599485 @default.
- W2037901402 hasConceptScore W2037901402C127413603 @default.
- W2037901402 hasConceptScore W2037901402C133386390 @default.
- W2037901402 hasConceptScore W2037901402C160671074 @default.
- W2037901402 hasConceptScore W2037901402C165801399 @default.
- W2037901402 hasConceptScore W2037901402C166972891 @default.
- W2037901402 hasConceptScore W2037901402C171250308 @default.
- W2037901402 hasConceptScore W2037901402C172385210 @default.
- W2037901402 hasConceptScore W2037901402C175708663 @default.
- W2037901402 hasConceptScore W2037901402C185592680 @default.
- W2037901402 hasConceptScore W2037901402C19067145 @default.
- W2037901402 hasConceptScore W2037901402C192562407 @default.
- W2037901402 hasConceptScore W2037901402C42360764 @default.
- W2037901402 hasConceptScore W2037901402C43617362 @default.
- W2037901402 hasConceptScore W2037901402C49040817 @default.
- W2037901402 hasConceptScore W2037901402C544956773 @default.
- W2037901402 hasLocation W20379014021 @default.
- W2037901402 hasOpenAccess W2037901402 @default.
- W2037901402 hasPrimaryLocation W20379014021 @default.
- W2037901402 hasRelatedWork W1619890874 @default.
- W2037901402 hasRelatedWork W1988773673 @default.
- W2037901402 hasRelatedWork W1991903218 @default.
- W2037901402 hasRelatedWork W2000367191 @default.
- W2037901402 hasRelatedWork W2000851099 @default.
- W2037901402 hasRelatedWork W2002472845 @default.
- W2037901402 hasRelatedWork W2022499479 @default.
- W2037901402 hasRelatedWork W2036321926 @default.
- W2037901402 hasRelatedWork W2047324639 @default.
- W2037901402 hasRelatedWork W2048062531 @default.
- W2037901402 hasRelatedWork W2057578392 @default.
- W2037901402 hasRelatedWork W2062667404 @default.
- W2037901402 hasRelatedWork W2064081474 @default.
- W2037901402 hasRelatedWork W2093633831 @default.
- W2037901402 hasRelatedWork W2119786256 @default.
- W2037901402 hasRelatedWork W2205833616 @default.
- W2037901402 hasRelatedWork W2560149840 @default.
- W2037901402 hasRelatedWork W2285059150 @default.
- W2037901402 hasRelatedWork W2408165345 @default.
- W2037901402 hasRelatedWork W2825711737 @default.
- W2037901402 isParatext "false" @default.
- W2037901402 isRetracted "false" @default.
- W2037901402 magId "2037901402" @default.
- W2037901402 workType "article" @default.