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- W2038395864 abstract "A new positive-type chemically amplified Si-contained resist, which consist of polysilsesquioxane and methacrylate copolymer has been developed for ArF excimer laser lithography. The resist which was developed in 2.38% TMAH(tetramethylammonium hydroxide) has a high sensitivity(5mJ/cm2), good O2-etching resistance (selectivity>10) and showed excellent resolution. When examined in the bi-layer resist process(BLR), well-defined sub 160nm patterns were obtained." @default.
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- W2038395864 date "1998-01-01" @default.
- W2038395864 modified "2023-10-04" @default.
- W2038395864 title "Chemically Amplified Si-containing Resist for Bilayer Resist Process." @default.
- W2038395864 doi "https://doi.org/10.2494/photopolymer.11.663" @default.
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