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- W2038776336 abstract "In the experiment, acid leaching under an ultrasonic field (20 kHz, 80 W) was used to remove Al, Fe, and Ti impurities in metallurgical grade silicon (MG-Si). The effects of the acid leaching process parameters, including the particle size of silicon, the acid type (HCl, HNO3, HF,) and the leaching time on the purification of MG-Si were investigated. The results show that HCl leaching, an initial size of 0.1 mm for the silicon particles, and 8 h of leaching time are the optimum parameters to purify MG-Si. The acid leaching process under an ultrasonic field is more effective than the acid leaching under magnetic stirring, the mechanism of which is preliminarily discussed." @default.
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- W2038776336 date "2009-04-29" @default.
- W2038776336 modified "2023-09-23" @default.
- W2038776336 title "Optimization of the acid leaching process by using an ultrasonic field for metallurgical grade silicon" @default.
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- W2038776336 doi "https://doi.org/10.1088/1674-4926/30/5/053002" @default.
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