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• W2038868822 abstract "Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC." @default.
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• W2038868822 date "2002-09-01" @default.
• W2038868822 modified "2023-10-16" @default.
• W2038868822 title "Four different approaches for the measurement of IC surface temperature: application to thermal testing" @default.
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• W2038868822 doi "https://doi.org/10.1016/s0026-2692(02)00051-4" @default.
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