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• W2039050059 abstract "Plasma-enhanced metal organic chemical vapour deposition of thin copper films at low substrate temperatures using copper-acetylacetonate is investigated for deposition on temperature-sensitive substrates. Films with electrical resistivity near bulk values, a smooth surface and good adhesion quality were deposited at substrate temperatures down to 80°C. Control of the film quality by optical emission spectroscopy of the process plasma was investigated." @default.
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• W2039050059 date "1993-10-01" @default.
• W2039050059 modified "2023-09-27" @default.
• W2039050059 title "Thin copper films deposited by low temperature plasma-enhanced metal organic chemical vapour deposition using copper-acetylacetonate" @default.
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• W2039050059 doi "https://doi.org/10.1016/0257-8972(93)90085-3" @default.
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