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- W2039373310 abstract "A comprehensive process characterization was performed at the Motorola plastic package assembly site in Selangor, Malaysia, to document the current fine pitch wire bond process capability, using state-of-the-art equipment, in an actual manufacturing environment. Two machines, representing the latest technology from two separate manufacturers, were operated one shift per day for five days, bonding a 132 lead Plastic Quad Flat Pack. Using a test device specifically designed for fine pitch wire bonding, the bonding programs were alternated between 107 micrometers and 92 micrometers pad pitch, running each pitch for a total of 1600 units per machine. Wire, capillary type, and related materials were standardized and commercially available. A video metrology measurement system, with a demonstrated six sigma repeatability band width of 0.51 micrometers , was utilized to measure the bonded units for bond dimensions and placement. Standard Quality Assurance (QA) metrics were also performed. Results indicate that state-of-the-art thermosonic wire bonding can achieve acceptable assembly yields at these fine pad pitches." @default.
- W2039373310 created "2016-06-24" @default.
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- W2039373310 date "1995-09-22" @default.
- W2039373310 modified "2023-09-26" @default.
- W2039373310 title "Fine pitch thermosonic wire bonding: analysis of state-of-the-art manufacturing capability" @default.
- W2039373310 doi "https://doi.org/10.1117/12.221452" @default.
- W2039373310 hasPublicationYear "1995" @default.
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