Matches in SemOpenAlex for { <https://semopenalex.org/work/W2039441684> ?p ?o ?g. }
Showing items 1 to 99 of
99
with 100 items per page.
- W2039441684 abstract "Cu pillar bumps are known to be one of the most promising candidates for the fine pitch interconnection materials because they do not cause bump bridging between adjacent bumps.[1] Also, Cu pillar bump is widely adopted as chip-to-substrate or chip-to-chip interconnect in 3D integration as well as flip chip package [2]. However, Cu pillar bump makes excessive intermetallic compound (IMC) and Kirkendall void at Cu pillar/solder interface, which can degrade the electrical and mechanical reliability of solder joints [3–5]. Therefore, it is essential to understand the fundamental growth mechanisms of IMC and Kirkendall void in the Cu pillar bump. In this work, current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D Integration was quantitatively evaluated by using in-situ SEM." @default.
- W2039441684 created "2016-06-24" @default.
- W2039441684 creator A5066865183 @default.
- W2039441684 creator A5074661321 @default.
- W2039441684 creator A5087791601 @default.
- W2039441684 date "2012-01-01" @default.
- W2039441684 modified "2023-10-11" @default.
- W2039441684 title "Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration" @default.
- W2039441684 cites W1967328334 @default.
- W2039441684 cites W1996293017 @default.
- W2039441684 cites W2019320351 @default.
- W2039441684 cites W2042028632 @default.
- W2039441684 cites W2042982549 @default.
- W2039441684 cites W2043639063 @default.
- W2039441684 cites W2085165005 @default.
- W2039441684 doi "https://doi.org/10.1109/3dic.2012.6263004" @default.
- W2039441684 hasPublicationYear "2012" @default.
- W2039441684 type Work @default.
- W2039441684 sameAs 2039441684 @default.
- W2039441684 citedByCount "0" @default.
- W2039441684 crossrefType "proceedings-article" @default.
- W2039441684 hasAuthorship W2039441684A5066865183 @default.
- W2039441684 hasAuthorship W2039441684A5074661321 @default.
- W2039441684 hasAuthorship W2039441684A5087791601 @default.
- W2039441684 hasConcept C105289051 @default.
- W2039441684 hasConcept C111368507 @default.
- W2039441684 hasConcept C119599485 @default.
- W2039441684 hasConcept C123745756 @default.
- W2039441684 hasConcept C125619702 @default.
- W2039441684 hasConcept C127313418 @default.
- W2039441684 hasConcept C127413603 @default.
- W2039441684 hasConcept C131024122 @default.
- W2039441684 hasConcept C159985019 @default.
- W2039441684 hasConcept C165005293 @default.
- W2039441684 hasConcept C191897082 @default.
- W2039441684 hasConcept C192562407 @default.
- W2039441684 hasConcept C27501479 @default.
- W2039441684 hasConcept C2777289219 @default.
- W2039441684 hasConcept C2779227376 @default.
- W2039441684 hasConcept C2779772531 @default.
- W2039441684 hasConcept C2780026712 @default.
- W2039441684 hasConcept C31258907 @default.
- W2039441684 hasConcept C41008148 @default.
- W2039441684 hasConcept C49040817 @default.
- W2039441684 hasConcept C50296614 @default.
- W2039441684 hasConcept C68928338 @default.
- W2039441684 hasConcept C78519656 @default.
- W2039441684 hasConcept C79072407 @default.
- W2039441684 hasConceptScore W2039441684C105289051 @default.
- W2039441684 hasConceptScore W2039441684C111368507 @default.
- W2039441684 hasConceptScore W2039441684C119599485 @default.
- W2039441684 hasConceptScore W2039441684C123745756 @default.
- W2039441684 hasConceptScore W2039441684C125619702 @default.
- W2039441684 hasConceptScore W2039441684C127313418 @default.
- W2039441684 hasConceptScore W2039441684C127413603 @default.
- W2039441684 hasConceptScore W2039441684C131024122 @default.
- W2039441684 hasConceptScore W2039441684C159985019 @default.
- W2039441684 hasConceptScore W2039441684C165005293 @default.
- W2039441684 hasConceptScore W2039441684C191897082 @default.
- W2039441684 hasConceptScore W2039441684C192562407 @default.
- W2039441684 hasConceptScore W2039441684C27501479 @default.
- W2039441684 hasConceptScore W2039441684C2777289219 @default.
- W2039441684 hasConceptScore W2039441684C2779227376 @default.
- W2039441684 hasConceptScore W2039441684C2779772531 @default.
- W2039441684 hasConceptScore W2039441684C2780026712 @default.
- W2039441684 hasConceptScore W2039441684C31258907 @default.
- W2039441684 hasConceptScore W2039441684C41008148 @default.
- W2039441684 hasConceptScore W2039441684C49040817 @default.
- W2039441684 hasConceptScore W2039441684C50296614 @default.
- W2039441684 hasConceptScore W2039441684C68928338 @default.
- W2039441684 hasConceptScore W2039441684C78519656 @default.
- W2039441684 hasConceptScore W2039441684C79072407 @default.
- W2039441684 hasLocation W20394416841 @default.
- W2039441684 hasOpenAccess W2039441684 @default.
- W2039441684 hasPrimaryLocation W20394416841 @default.
- W2039441684 hasRelatedWork W1983138303 @default.
- W2039441684 hasRelatedWork W2009532298 @default.
- W2039441684 hasRelatedWork W2023720701 @default.
- W2039441684 hasRelatedWork W2036397973 @default.
- W2039441684 hasRelatedWork W2037655885 @default.
- W2039441684 hasRelatedWork W2059279937 @default.
- W2039441684 hasRelatedWork W2061883437 @default.
- W2039441684 hasRelatedWork W2071329557 @default.
- W2039441684 hasRelatedWork W2093848211 @default.
- W2039441684 hasRelatedWork W2132233750 @default.
- W2039441684 hasRelatedWork W2157762801 @default.
- W2039441684 hasRelatedWork W2258648545 @default.
- W2039441684 hasRelatedWork W2540020002 @default.
- W2039441684 hasRelatedWork W2540965620 @default.
- W2039441684 hasRelatedWork W2765655851 @default.
- W2039441684 hasRelatedWork W2902976420 @default.
- W2039441684 hasRelatedWork W3129503484 @default.
- W2039441684 hasRelatedWork W3189973866 @default.
- W2039441684 hasRelatedWork W3208124006 @default.
- W2039441684 hasRelatedWork W3208918273 @default.
- W2039441684 isParatext "false" @default.
- W2039441684 isRetracted "false" @default.
- W2039441684 magId "2039441684" @default.
- W2039441684 workType "article" @default.