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- W2040061024 abstract "Electromigration in metallic conductor lines is a complicated field which ranges from microscopic damage mechanisms to reliability modelling. This paper presents, for the first time, an explicit model which not only predicts lifetimes of conductor lines but also describes the microscopic damage behavior. It is based on quantitative characterization of damage evolution in Al-based lines, as a function of current density (1–2.5 MA/cm2) and of line width (1–5 μm). The model, which predicts the times for nucleation and growth of electromigration voids, contains parameters such as current density, line width, diffusivities and grain size. A central quality is the critical current density (“Blech effect”), which is evaluated independently from mechanical measurements and from measurements of void-hillock spacings. Quantitative agreement is reached between the model and experimental data for lifetimes and void densities in pure Al, as well as AlSiCu and AlCu from previous investigation. The consequences are visualized in “electromigration damage maps”, which question the validity of empirical lifetime extrapolations. It is concluded that severe decreases in lifetimes must be expected for line widths below about 0.5 μm." @default.
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- W2040061024 date "1998-07-01" @default.
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- W2040061024 title "Current density and line width effects in electromigration: a new damage-based lifetime model" @default.
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- W2040061024 doi "https://doi.org/10.1016/s1359-6454(97)00245-0" @default.
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