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- W2040205156 abstract "A Ti coating was deposited on not only surface but also inner surface (pore wall) of a lotus-type porous copper with porosity of 43.3% and pore size of 603.5μm by arc air plating for modification. The structure, microhardness and compressive properties of the porous copper were investigated, and compared to those after annealing under 600°C and 800°C for 6 hours. It is indicated that Ti coating with thickness from 4.6μm to 12.5μm has been deposited on the pore wall for the porous copper successfully. It is found that the HV 0.01 increases from 89.32 to 348.19 for the porous copper after the deposition, which is attributed to the higher hardness of the Ti coating. In case of 0.2% yield stress, it keeps almost the same for the porous copper with the deposition of the Ti coating, while increases from 21.22 to 23.79MPa after annealing, which may stem from the improved adhesion of the coating with pore wall by diffusion. It is believed and much possible for metal coating to improve the mechanical properties of lotus-type porous metal." @default.
- W2040205156 created "2016-06-24" @default.
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- W2040205156 date "2014-10-01" @default.
- W2040205156 modified "2023-10-15" @default.
- W2040205156 title "Structure and Mechanical Properties of Lotus-Type Porous Copper with a Ti Coating on the Pore Wall by Arc Ion Plating" @default.
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- W2040205156 doi "https://doi.org/10.4028/www.scientific.net/msf.804.263" @default.
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